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  2. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    CPU heat sink with fan attached A heat sink (aluminium) incorporating a heat pipe (copper) All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. [1]

  3. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    To the right is a smaller heat sink cooling another integrated circuit of the motherboard. Typical heatsink-fan combination found on a consumer laptop. The heatpipes which contain a working fluid make direct contact with the CPU and GPU, conducting heat away from the component and transferring it to the fin-stack mounted on the exhaust port of ...

  4. Thermal management of high-power LEDs - Wikipedia

    en.wikipedia.org/wiki/Thermal_management_of_high...

    Heat sinks provide a path for heat from the LED source to outside medium. Heat sinks can dissipate power in three ways: conduction (heat transfer from one solid to another), convection (heat transfer from a solid to a moving fluid, which for most LED applications will be air), or radiation (heat transfer from two bodies of different surface temperatures through Thermal radiation).

  5. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.

  6. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    Heatsink mounted on a motherboard, cooling the CPU underneath it. This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is ...

  7. Computer fan control - Wikipedia

    en.wikipedia.org/wiki/Computer_fan_control

    The sense pin is used to relay the rotation speed of the fan and the control pin is an open-drain or open-collector output, which requires a pull-up to 5 V or 3.3 V in the fan. Unlike linear voltage regulation, where the fan voltage is proportional to the speed, the fan is driven with a constant supply voltage; the speed control is performed by ...

  8. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  9. Computer fan - Wikipedia

    en.wikipedia.org/wiki/Computer_fan

    To cool these components, fans are used to move heated air away from the components and draw cooler air over them. Fans attached to components are usually used in combination with a heat sink to increase the area of heated surface in contact with the air, thereby improving the efficiency of cooling. Fan control is not always an automatic ...

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