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For similar reasons, a technique called trace necking reduces (or necks down [7] [8] [9]) the width of a trace that approaches a narrower pad of a surface-mounted device or a through-hole with a diameter that is less than the width of the trace, or when the trace passes through bottlenecks (for example, between the pads of a component).
A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board.The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15.
Reverse engineering of printed circuit boards (sometimes called “cloning”, or PCB RE) is the process of generating fabrication and design data for an existing circuit board, either closely or exactly replicating its functionality. [1] Obtaining circuit board design data is not by necessity malicious or aimed at intellectual property theft ...
Thermal expansion mismatch between the printed circuit board material and component packaging strains the part-to-board bonds. Thermal cycling may lead to fatigue cracking of the solder joints. Loose particles, like weld flash and tin whiskers , can form in the device cavity and migrate inside the packaging, causing often intermittent and shock ...
In electronic design, wire routing, commonly called simply routing, is a step in the design of printed circuit boards (PCBs) and integrated circuits (ICs). It builds on a preceding step, called placement , which determines the location of each active element of an IC or component on a PCB.
Even after the introduction of printed circuit boards, it did not require laying out and manufacturing circuit boards. Point-to-point and terminal strip construction continued to be used for some vacuum tube equipment even after the introduction of printed circuit boards. The heat of the tubes can degrade the circuit boards and cause them to ...
A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
ATPG (acronym for both automatic test pattern generation and automatic test pattern generator) is an electronic design automation method or technology used to find an input (or test) sequence that, when applied to a digital circuit, enables automatic test equipment to distinguish between the correct circuit behavior and the faulty circuit behavior caused by defects.