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Adamant Namiki uses integrated manufacturing, handling its products from the raw material, to processing, through to polishing. Industrial jewels, such as diamond, sapphire, and ruby, are used for jewel bearings, sapphire substrates, [4] [5] exterior watch parts, semiconductor wire bonding capillaries, nozzles, LTCC [6] (Co-fired ceramic) and so on.
In 1999, Wacker Siltronic Singapore Pte Ltd opened its 200 mm wafer production plant in Singapore. [2] [5] In 2004, the company changed its name to Siltronic AG. [6] The company manufactures silicon wafers with diameters of up to 300 mm at its two German production sites in Burghausen and Freiberg, as well as at sites in Asia and the USA.
Systems on Silicon Manufacturing Company Pte. Ltd. (more commonly known as SSMC) is a Singaporean semiconductor fabrication company located in Pasir Ris Wafer Fab Park. It was incorporated in 1999 and is a joint venture between NXP Semiconductors (until 2006 Philips) and TSMC. Founded by Philips and EDB Investments, the plant was completed in ...
This is a list of semiconductor fabrication plants, factories where integrated circuits (ICs), also known as microchips, are manufactured.They are either operated by Integrated Device Manufacturers (IDMs) that design and manufacture ICs in-house and may also manufacture designs from design-only (fabless firms), or by pure play foundries that manufacture designs from fabless companies and do ...
On Wednesday, RTX Corporation (NYSE:RTX) said Raytheon has secured a three-year, two-phase contract from DARPA to develop foundational ultra-wide bandgap semiconductors. These will be based on ...
ASM (previously known as ASM International N.V., originally standing for Advanced Semiconductor Materials) is a Dutch headquartered multinational corporation that specializes in the design, manufacturing, sales and service of semiconductor wafer processing equipment for the fabrication of semiconductor devices.
ASE provides semiconductor assembly and testing services for over 90 percent of electronics companies in the world. [10] The packaging services include fan-out wafer-level packaging (FO-WLP), wafer-level chip-scale packaging (WL-CSP), flip chip, 2.5D and 3D packaging, system in package (SiP) and copper wire bonding. [9] [11]
Founded in 1997 by Inderjit Singh and commencing full operations in 1999, the company started out by acquiring the semiconductor test operations of Fujitsu Microelectronics Asia Pte. Ltd. At the end of 2006, the company was ranked the fifth largest independent provider of semiconductor tests by Gartner Dataquest. [ 2 ]
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