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  2. Wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Wafer-level_packaging

    Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still ...

  3. Chip-scale package - Wikipedia

    en.wikipedia.org/wiki/Chip-scale_package

    The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level package (WLP) or a wafer-level chip-scale ...

  4. Embedded wafer level ball grid array - Wikipedia

    en.wikipedia.org/wiki/Embedded_Wafer_Level_Ball...

    eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The main driving force behind the eWLB technology was to allow fanout and more space for interconnect routing. All process steps for the generation of the package are performed on the wafer.

  5. Cartridge (firearms) - Wikipedia

    en.wikipedia.org/wiki/Cartridge_(firearms)

    Removing the spent primer from (decapping) these cases requires the use of a special tool because the primer anvil (on which the primer compound is crushed) is an integral part of the case and the case, therefore, does not have a central hole through which a decapping tool can push the primer out from the inside, as is done with Boxer primers.

  6. Fan-out wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Fan-out_wafer-level_packaging

    By contrast, in standard WLP flows integrated circuits are packaged while still part of the wafer, and the wafer (with outer layers of packaging already attached) is diced afterwards; the resulting package is practically of the same size as the die itself. However, the advantage of having a small package comes with a downside of limiting the ...

  7. .460 Weatherby Magnum - Wikipedia

    en.wikipedia.org/wiki/.460_Weatherby_Magnum

    The recoil of the full-power loads is very punishing and if the gun has a scope, scope cuts on the forehead are common. [48] A factory powder charge for this cartridge is about 115 grains (7.5 g). For many years the Weatherby Mark V rifles chambered in .460 Weatherby were equipped with Pendleton muzzle brakes [ 2 ] to help alleviate the effects ...

  8. List of Winchester Center Fire cartridges - Wikipedia

    en.wikipedia.org/wiki/List_of_Winchester_Center...

    List of Winchester Center Fire rifle cartridges.More commonly known as WCF, it is a family of cartridges designed by Winchester Repeating Arms Company. [1] There are many other Winchester cartridges that do not carry the WCF moniker, such as the .300 WSM. .270 Winchester, and .300 Winchester Magnum

  9. Primer (firearms) - Wikipedia

    en.wikipedia.org/wiki/Primer_(firearms)

    With the advent of chemical primers, it was not long before several systems were invented with many different ways of combining bullet, powder, and primer into a single package which could be loaded quickly from the breech of the firearm. This greatly streamlined the reloading procedure and paved the way for semi- and fully automatic firearms.