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A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Arctic Silver Inc. is a privately owned engineering corporation which develops and manufactures thermally conductive compounds and thermal adhesives for the application of heat sinks to high-powered electronic components such as processors, LEDs, chipsets and other electronic devices.
Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
Both filled and unfilled EVA materials have good low temperature properties and are tough. The materials with approximately 11% VA are used as hot-melt adhesives. The EVA copolymer which is based on a high proportion of VA (greater than 60%) is referred to as ethylene-vinyl acetate rubber. [1]
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
IEC 60447 Basic and safety principles for man-machine interface, marking and identification – Actuating principles; IEC 60450 Measurement of the average viscometric degree of polymerization of new and aged cellulosic electrically insulating materials; IEC 60454 Specifications for pressure-sensitive adhesive tapes for electrical purposes
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