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  2. BiCMOS - Wikipedia

    en.wikipedia.org/wiki/BiCMOS

    Some of the advantages of CMOS fabrication, for example very low cost in mass production, do not transfer directly to BiCMOS fabrication. An inherent difficulty arises from the fact that optimizing both the BJT and MOS components of the process is impossible without adding many extra fabrication steps and consequently increased process cost and reduced yield.

  3. List of semiconductor scale examples - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    NEC and Toshiba used this process for their 4 Mb DRAM memory chips in 1986. [47] Hitachi, IBM, Matsushita and Mitsubishi Electric used this process for their 4 Mb DRAM memory chips in 1987. [37] Toshiba's 4 Mb EPROM memory chip in 1987. [47] Hitachi, Mitsubishi and Toshiba used this process for their 1 Mb SRAM memory chips in 1987. [47]

  4. List of semiconductor fabrication plants - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    This is a list of semiconductor fabrication plants, factories where integrated circuits (ICs), also known as microchips, are manufactured.They are either operated by Integrated Device Manufacturers (IDMs) that design and manufacture ICs in-house and may also manufacture designs from design-only (fabless firms), or by pure play foundries that manufacture designs from fabless companies and do ...

  5. List of Intel Pentium Pro processors - Wikipedia

    en.wikipedia.org/wiki/List_of_Intel_Pentium_Pro...

    The 150 MHz Pentium Pro processor dies (B0, C0) used a 0.50 μm BiCMOS process. The 166, 180, and 200 MHz Pentium Pro processor dies (sA0, sA1, sB1) used a 0.35 μm CMOS process. The sA0 stepping is logically equivalent to the C0 stepping, but on a different manufacturing process. [1]

  6. Die singulation - Wikipedia

    en.wikipedia.org/wiki/Die_singulation

    Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.

  7. Samsung's preliminary Q4 profit falls far short of estimates ...

    www.aol.com/news/samsung-q4-profit-outlook...

    SEOUL (Reuters) -Samsung Electronics' preliminary fourth-quarter operating profit missed estimates by a large margin, with the South Korean tech giant hit hard by extra costs as it works towards ...

  8. Front end of line - Wikipedia

    en.wikipedia.org/wiki/Front_end_of_line

    Illustration of FEOL (device generation in the silicon, bottom) and BEOL (depositing metalization layers, middle part) to connect the devices. CMOS fabrication process. The front end of line (FEOL) is the first portion of IC fabrication where the individual components (transistors, capacitors, resistors, etc.) are patterned in a semiconductor substrate. [1]

  9. Homeowners Say Airbnb Guests Caused More Than $26,000 ... - AOL

    www.aol.com/homeowners-airbnb-guests-caused-more...

    The couple is working with Airbnb and contractors to begin the repairs process. Airbnb currently offers a host damage protection called AirCover, which provides up to $3 million protection in the ...