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When buffing there are two types of buffing motions: the cut motion and the color motion. The cut motion is designed to give a uniform, smooth, semi-bright surface finish. This is achieved by moving the workpiece against the rotation of the buffing wheel, while using medium to hard pressure. The color motion gives a clean, bright, shiny surface ...
Metal tumbling is used to burnish, deburr, clean, radius, de-flash, descale, remove rust, polish, brighten, surface harden, prepare parts for further finishing, and break off die cast runners. [citation needed] The process is fairly simple: a horizontal barrel is filled with the parts which is then rotated. Variations of this process usually ...
The part is sisal buffed and then color buffed to achieve a mirror finish. The quality of this finish is dependent on the quality of the metal being polished. Some alloys of steel and aluminum cannot be brought to a mirror finish. Castings that have slag or pits will also be difficult, if not impossible, to polish to a #8.
Electropolishing, also known as electrochemical polishing, anodic polishing, or electrolytic polishing (especially in the metallography field), is an electrochemical process that removes material from a metallic workpiece, reducing the surface roughness by levelling micro-peaks and valleys, improving the surface finish.
Polishing is the process of creating a smooth and shiny surface by rubbing it or by applying a chemical treatment, leaving a clean surface with a significant specular reflection (still limited by the index of refraction of the material according to the Fresnel equations). [1]
Honing is an abrasive machining process that produces a precision surface on a metal workpiece by scrubbing an abrasive grinding stone or grinding wheel against it along a controlled path. Honing is primarily used to improve the geometric form of a surface, but can also improve the surface finish.
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In order to compensate for the wafer bow, pressure can be applied to the wafer's backside which, in turn, will equalize the centre-edge differences. The pads used in the CMP tool should be rigid in order to uniformly polish the wafer surface. However, these rigid pads must be kept in alignment with the wafer at all times.
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