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The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores. All consumer desktop Ryzens (except PRO models) and all mobile processors with the HX suffix have an unlocked multiplier.
AMD mobile Kite Refresh platform Mobile processor Processors – Socket S1 Turion 64 X2 dual-core 64-bit Hawk family processor 65 nm (codenamed Tyler), or; Mobile Sempron single-core 64-bit processor 65 nm (codenamed Sherman) Mobile chipset HDMI, HyperTransport 1.0 and PCI Express 1.0; DDR2-800 SO-DIMM; Mobile support
Architecture Fabrication (nm) Family Release Date Code name Model Group Cores SMT Clock rate () Bus Speed & Type [a] Cache Socket Memory Controller Features L1 L2
Advanced Micro Devices' (AMD) noted that laptops based on its Ryzen 5000 Series mobile processors will be available from first quarter of 2021 from leading manufacturers.
This article gives a list of AMD microprocessors, sorted by generation and release year.If applicable and openly known, the designation(s) of each processor's core (versions) is (are) listed in parentheses.
The Ryzen 7000 mobile series initially launched in September 2022 with the Ryzen 7020 Mendocino line of low-end Zen 2 ultra mobile processors. [ 78 ] In early 2023, the rest of the Ryzen 7000 mobile lineup was released, starting with Ryzen 7030, Ryzen 7035, and later Ryzen 7045 and Ryzen 7040 series processors.
AMD Zen 3+ Family 19h – 2022 revision of Zen 3 used in Ryzen 6000 mobile processors using a 6 nm process. AMD Zen 4 Family 19h – fourth generation Zen architecture, in 5 nm process. [5] Used in Ryzen 7000 consumer processors on the new AM5 platform with DDR5 and PCIe 5.0 support. Adds support for AVX-512 instruction set.
Common features of Ryzen 5000 notebook APUs: Socket: FP6. All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 512 KB per core. All the CPUs support 16 PCIe 3.0 lanes. Includes integrated GCN 5th generation GPU. Fabrication process: TSMC 7FF.
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