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Closeup of the pins of a pin grid array The pin grid array at the bottom of prototype Motorola 68020 microprocessor The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket. A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are ...
Socket A (also known as Socket 462) is a zero insertion force pin grid array (PGA) CPU socket used for AMD processors ranging from the Athlon Thunderbird to the Athlon XP/MP 3200+, and AMD budget processors including the Duron and Sempron. Socket A also supports AMD Geode NX embedded processors (derived from the Mobile Athlon XP).
Land grid array (LGA): An array of bare lands only. Similar to in appearance to QFN , but mating is by spring pins within a socket rather than solder. Column grid array (CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern.
Socket AM2; Release date: May 2006: Type: PGA-ZIF: Chip form factors: Ceramic Pin Grid Array (CPGA) Organic Pin Grid Array (OPGA) Contacts: 940: FSB frequency: 200 MHz System clock 1 GHz HyperTransport 2.0: Processors: Athlon 64 Athlon 64 X2 Athlon 64 FX Opteron Sempron Phenom: Predecessor: Socket 939: Successor: AM2+
CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed. CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands ...
Socket AM2+ Release date: November 2007: Type: PGA-ZIF: Chip form factors: Ceramic Pin Grid Array (CPGA) Organic Pin Grid Array (OPGA) Contacts: 940: FSB frequency: 200 MHz System clock up to 2.6 GHz HyperTransport 3.0: Processors: Athlon 64 Athlon 64 X2 Athlon II Opteron Phenom Phenom II: Predecessor: AM2: Successor: AM3
LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
This is thinner than a pin grid array socket arrangement, but is not removable. The 479 balls of the Micro-FCBGA package (a package almost identical to the 478-pin socketable micro-FCPGA package) are arranged as the 6 outer rings of a 1.27 mm pitch (20 balls per inch pitch) 26x26 square grid, with the inner 14x14 region empty.