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Sketch of the eWLB package, the first commercialized FO-WLP technology. Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions.
The iPhone 7 was rumored to use fan-out wafer-level packaging technology in order to achieve a thinner and lighter model. [ 2 ] [ 3 ] [ needs update ] Wafer-level chip scale packaging (WL-CSP) is the smallest package currently available on the market and is produced by OSAT (Outsourced Semiconductor Assembly and Test) companies, such as ...
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound. Principle eWLB. eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The ...
Fan-out WLCSP: Fan-out wafer-level packaging: Variation of WLCSP. Like a BGA package but with the interposer built directly atop the die and encapsulated alongside it. eWLB: Embedded wafer level ball grid array: Variation of WLCSP. MICRO SMD-Chip-size package (CSP) developed by National Semiconductor [21] COB: Chip on board: Bare die supplied ...
Advanced packaging includes multi-chip modules, 3D ICs, [2] 2.5D ICs, [2] heterogeneous integration, [3] fan-out wafer-level packaging, [2] system-in-package, quilt packaging, combining logic (processors) and memory in a single package, die stacking, wafer bonding/stacking, several chiplets or dies in a package, [2] combinations of these ...
People who design digital integrated circuits typically insert trees whenever necessary such that the fan-in and fan-out of each and every gate on the chip is between 2 and 10. [1] Dynamic or AC fan-out, not DC fan-out is therefore the primary limiting factor in many practical cases, due to the speed limitation.
The following is a list of 7400-series digital logic integrated ... obsolete. 74LS51 pinout diagram TI SN74LS51 in DIP-14 package ... (fan-out N O = 10). Outputs with ...
According to the research firm Yole Développement, the fan-out packaging market is predicted to reach $2.4 billion by 2020, increasing from $174 million in 2014. [ 12 ] Wafer-level chip-scale packaging (WL-CSP) is the technology that enables the smallest available packages in the market, meeting the increasing demand for smaller and faster ...