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2. Thermoelectric cooling - Wikipedia

   en.wikipedia.org/wiki/Thermoelectric_cooling

   Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.

3. Thermoelectric effect - Wikipedia

   en.wikipedia.org/wiki/Thermoelectric_effect

   The Peltier effect can be used to create a heat pump. Notably, the Peltier thermoelectric cooler is a refrigerator that is compact and has no circulating fluid or moving parts. Such refrigerators are useful in applications where their advantages outweigh the disadvantage of their very low efficiency.

4. Thermoelectric generator - Wikipedia

   en.wikipedia.org/wiki/Thermoelectric_generator

   The typical efficiency of TEGs is around 5–8%, although it can be higher. Older devices used bimetallic junctions and were bulky. More recent devices use highly doped semiconductors made from bismuth telluride (Bi 2 Te 3), lead telluride (PbTe), [10] calcium manganese oxide (Ca 2 Mn 3 O 8), [11] [12] or combinations thereof, [13] depending on application temperature.

5. Marlow Industries - Wikipedia

   en.wikipedia.org/wiki/Marlow_Industries

   Marlow Industries Incorporated was founded by Raymond Marlow in 1973. [1] It was focused on thermoelectric cooling technology, value-added systems for the aerospace, defense, medical, industrial, automotive, power and defense sectors.

6. Thermoelectric materials - Wikipedia

   en.wikipedia.org/wiki/Thermoelectric_materials

   The efficiency of a thermoelectric device for electricity generation is given by , defined as =.. The maximum efficiency of a thermoelectric device is typically described in terms of its device figure of merit where the maximum device efficiency is approximately given by [7] = + ¯ + ¯ +, where is the fixed temperature at the hot junction, is the fixed temperature at the surface being cooled ...

7. Thermal copper pillar bump - Wikipedia

   en.wikipedia.org/wiki/Thermal_copper_pillar_bump

   A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).