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  2. Wafer (electronics) - Wikipedia

    en.wikipedia.org/wiki/Wafer_(electronics)

    The step up to 300 mm required major changes, with fully automated factories using 300 mm wafers versus barely automated factories for the 200 mm wafers, partly because a FOUP for 300 mm wafers weighs about 7.5 kilograms [48] when loaded with 25 300 mm wafers where a SMIF weighs about 4.8 kilograms [49] [50] [18] when loaded with 25 200 mm ...

  3. Wafer fabrication - Wikipedia

    en.wikipedia.org/wiki/Wafer_fabrication

    Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...

  4. Czochralski method - Wikipedia

    en.wikipedia.org/wiki/Czochralski_method

    A puller rod with seed crystal for growing single-crystal silicon by the Czochralski method Crucibles used in Czochralski method Crucible after being used. When silicon is grown by the Czochralski method, the melt is contained in a silica crucible. During growth, the walls of the crucible dissolve into the melt and Czochralski silicon therefore ...

  5. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    Another method, called silicon on insulator technology involves the insertion of an insulating layer between the raw silicon wafer and the thin layer of subsequent silicon epitaxy. This method results in the creation of transistors with reduced parasitic effects. Semiconductor equipment may have several chambers which process wafers in ...

  6. Wafering - Wikipedia

    en.wikipedia.org/wiki/Wafering

    Wafering is the process by which a silicon crystal is made into wafers. This process is usually carried out by a multi-wire saw which cuts multiple wafers from the same crystal at the same time. These wafers are then polished to the desired degree of flatness and thickness.

  7. Wafer backgrinding - Wikipedia

    en.wikipedia.org/wiki/Wafer_backgrinding

    Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC). ICs are produced on semiconductor wafers that undergo a multitude of processing steps. The silicon wafers

  8. How to Make Benne Seed Wafers—the Cookie Your ... - AOL

    www.aol.com/benne-seed-wafers-cookie-holidays...

    This year, in addition to classics like rugelach, spritz and thumbprint cookies, include benne seed wafers in your cookie spread. Benne seed cookies are a traditional Kwanzaa cookie made with ...

  9. Boule (crystal) - Wikipedia

    en.wikipedia.org/wiki/Boule_(crystal)

    As the seed is extracted the silicon solidifies and eventually a large, cylindrical boule is produced. [ 3 ] A semiconductor crystal boule is normally cut into circular wafers using an inside hole diamond saw or diamond wire saw , and each wafer is lapped and polished to provide substrates suitable for the fabrication of semiconductor devices ...