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Materion Corp. is a multinational company specializing in high-performance engineered materials.Among their products are precious and non-precious metals, inorganic chemicals, specialty coatings, beryllium, specialty engineered beryllium, beryllium copper alloys, ceramics, and engineered clad and plated metal systems.
In 1932, Lewis T. Briggs Sr., a part-owner of the Erie Bronze Company, bought out Smith's co-investors and became president of the eight-person company. During World War II the Erie Plating Company expanded into plating military components. The main wartime products produced in Erie were bomb fuses, aircraft parts, and communication equipment.
Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [3] To clean and protect the part during the plating process, a combination of heat treating, cleaning, masking, pickling, and etching may be used. [1]
The operator dips the brush in plating solution and then applies it to the item, moving the brush continually to get an even distribution of the plating material. Brush electroplating has several advantages over tank plating, including portability, the ability to plate items that for some reason cannot be tank plated (one application was the ...
Nickel plating may refer to: Nickel electroplating , a technique of electroplating a thin layer of nickel onto a metal object Electroless nickel-phosphorus plating , an auto-catalytic chemical technique used to deposit a layer of nickel-phosphorus on a solid workpiece
The main ingredients of an electroless nickel plating bath are source of nickel cations Ni 2+, usually nickel sulfate and a suitable reducing agent, such as hypophosphite H 2 PO − 2 or borohydride BH − 4. [1] With hypophosphite, the main reaction that produces the nickel plating yields orthophosphite H 2 PO − 3, elemental phosphorus ...
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
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