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It is the higher-speed successor to DDR and DDR2 and predecessor to DDR4 synchronous dynamic random-access memory (SDRAM) chips. DDR3 SDRAM is neither forward nor backward compatible with any earlier type of random-access memory (RAM) because of different signaling voltages, timings, and other factors. DDR3 is a DRAM interface specification.
The CAS latency is the delay between the time at which the column address and the column address strobe signal are presented to the memory module and the time at which the corresponding data is made available by the memory module. The desired row must already be active; if it is not, additional time is required.
As with all DDR SDRAM generations, commands are still restricted to one clock edge and command latencies are given in terms of clock cycles, which are half the speed of the usually quoted transfer rate (a CAS latency of 8 with DDR3-800 is 8/(400 MHz) = 20 ns, exactly the same latency of CAS2 on PC100 SDR SDRAM). DDR3 memory chips are being made ...
It is for this reason that DDR3-2666 CL9 has a smaller absolute CAS latency than DDR3-2000 CL7 memory. Both for DDR3 and DDR4, the four timings described earlier are not the only relevant timings and give a very short overview of the performance of memory. The full memory timings of a memory module are stored inside of a module's SPD chip.
DDR SDRAM specification was finalized by JEDEC in June 2000 (JESD79). [9] JEDEC has set standards for the data rates of DDR SDRAM, divided into two parts. The first specification is for memory chips, and the second is for memory modules. The first retail PC motherboard using DDR SDRAM was released in August 2000. [10]
Memory latency is the time (the latency) between initiating a request for a byte or word in memory until it is retrieved by a processor. If the data are not in the processor's cache , it takes longer to obtain them, as the processor will have to communicate with the external memory cells.
A DIMM (Dual In-Line Memory Module) is a popular type of memory module used in computers. It is a printed circuit board with one or both sides (front and back) holding DRAM chips and pins . [ 1 ] The vast majority of DIMMs are manufactured in compliance with JEDEC memory standards , although there are proprietary DIMMs.
Memory controller with differential serial connections to DDR2 FB-DIMMs. The AMB is visible in the center of each DIMM. A Fully Buffered DIMM (FB-DIMM) is a type of memory module used in computer systems. It is designed to improve memory performance and capacity by allowing multiple memory modules to be each connected to the memory controller ...
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