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3D printing, or additive manufacturing, is the construction of a three-dimensional object from a CAD model or a digital 3D model. [1] [2] [3] It can be done in a variety of processes in which material is deposited, joined or solidified under computer control, [4] with the material being added together (such as plastics, liquids or powder grains being fused), typically layer by layer.
Bink uses a wavelet-based compression algorithm optimized for game video sequences. It supports resolutions up to 4K and can encode at bitrates from 500 kbps to 200 Mbps. The codec is designed for efficient decompression, leveraging multithreading and SIMD instructions on modern CPUs.
3D Viewer (formerly Mixed Reality Viewer and before that, View 3D) [2] [3] [4] is a 3D computer graphics viewer and augmented reality application that was first included in Windows 10 1703. It supports the .fbx , .3mf , .obj , and .stl and many more file formats [ 5 ] listed in features section.
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Multi-material 3D printing is the additive manufacturing procedure of using multiple materials at the same time to fabricate an object. Similar to single material additive manufacturing it can be realised through methods such as FFF, SLA and Inkjet (material jetting) 3D printing.
In the United States, the Hill Air Force base is using 3D printed parts in repair of fighter jets. [76] Higher education has proven to be a major buyer of desktop and professional 3D printers. [77] Significant desktop 3D printer purchases by both K-12 and universities helped sustain a desktop 3D printer market that had problems in 2015–2016. [78]
3D Manufacturing Format or 3MF is an open source file format standard developed and published by the 3MF Consortium. [1] [2] 3MF is an XML-based data format designed specifically for additive manufacturing. It includes information about materials, colors, and other information that cannot be represented in the STL format.
There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]