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This uses the same ATmega328 as late-model Duemilanove, but whereas the Duemilanove used an FTDI chip for USB, the Uno uses an ATmega16U2 (ATmega8U2 before rev3) programmed as a serial converter. Arduino Mega2560 [24] Arduino Yes ATmega2560 [25] 16 MHz Mega 4 in × 2.1 in [ 101.6 mm × 53.3 mm ] USB 8U2 [22] (Rev1&2)/ 16U2 [11] (Rev3) 5 V 256 4 8
Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package. COF: Chip ...
The Gerber format is an open, ASCII, vector format for printed circuit board (PCB) designs. [1] It is the de facto standard used by PCB industry software to describe the printed circuit board images: copper layers, solder mask, legend, drill data, etc. [2] [3] [4] The standard file extension is .GBR or .gbr [1] though other extensions like .GB, .geb or .gerber are also used.
Some single-sided boards which have plated-through holes are made in this way. General Electric made consumer radio sets in the late 1960s using additive boards. The (semi-)additive process is commonly used for multi-layer boards as it facilitates the plating -through of the holes to produce conductive vias in the circuit board.
Single-sided flexible circuits have a conductor layer made of either a metal or conductive (metal filled) polymer on a flexible dielectric film. Component termination features are accessible only from one side. Holes may be formed in the base film to allow component leads to pass through for interconnection, normally by soldering.
A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.
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