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Chip carrier. In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large. [1]
Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. The packaging stage is followed by testing of the ...
A modern example of multi-chip integrated circuit packages would be certain models of microprocessor, which may include separate dies for such things as cache memory within the same package. In a technique called flip chip, digital integrated circuit dies are inverted and soldered to a module carrier, for assembly into large systems. [8]
A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and/or embedded in the ...
Ball grid array. A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins ...
This is known as a chip-first flow. Panel level packaging uses a large panel instead of a wafer to carry out the packaging process. [6] High end fan-out packages are those with lines and spaces narrower than 8 microns. [4] Fan-out packages can also have several dies, [5] and passive components. [6]
Quad flat package. A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. [1] Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common.