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Aluminum is the most commonly chosen encapsulant for its strength, low mass, cost, manufacturability, and thermal conductivity. Since APG's conductivity is much lower through its thickness, thermal vias are sometimes inserted into the assembly to transfer heat into the graphite, as shown in Figure 1. These vias are typically composed of ...
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Windows 8 (also sometimes referred to as Windows 8 (Core) to distinguish from the OS itself) [2] is the basic edition of Windows for the IA-32 and x64 architectures. This edition contains features aimed at the home market segment and provides all of the basic new Windows 8 features.
A screenshot of Windows Embedded 8 Industry. It is almost identical to Windows 8 with no real changes (apart from the branding), and uses the Metro version of the Windows Aero theme. Based on Windows 8, [25] Windows Embedded 8 Industry was released on April 2, 2013 [15] [26] and is available in Pro, Pro Retail, and Enterprise editions.
Get answers to your AOL Mail, login, Desktop Gold, AOL app, password and subscription questions. Find the support options to contact customer care by email, chat, or phone number.
Kevlar (para-aramid) [2] is a strong, heat-resistant synthetic fiber, related to other aramids such as Nomex and Technora.Developed by Stephanie Kwolek at DuPont in 1965, [3] [2] [4] the high-strength material was first used commercially in the early 1970s as a replacement for steel in racing tires.
libarchive automatically detects and reads archive formats. [6] If the archive is compressed, libarchive also detects and handles compression formats before evaluating the archive. [6] libarchive is designed to minimize the copying of data internally for optimal performance. [7] Supported archive formats: [8] 7z – read and write; ar – read ...
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).