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  2. Thermocompression bonding - Wikipedia

    en.wikipedia.org/wiki/Thermocompression_bonding

    Compared to Al or Cu, it does not form an oxide. This allows to skip a surface cleaning procedure before bonding. [1] Copper has the disadvantage that the damascene process is very extensive. [5] It also immediately forms a surface oxide which can, however, be removed by formic acid vapor cleaning. Oxide removal doubles as surface passivation.

  3. Color chart - Wikipedia

    en.wikipedia.org/wiki/Color_chart

    Color chips or color samples from a plastic pellet manufacturer that enables customers to evaluate the color range as molded objects to see final effects. A color chart or color reference card is a flat, physical object that has many different color samples present. They can be available as a single-page chart, or in the form of swatchbooks or ...

  4. Plasma-activated bonding - Wikipedia

    en.wikipedia.org/wiki/Plasma-activated_bonding

    The decrease of temperature is based on the increase of bonding strength using plasma activation on clean wafer surfaces. Further, the increase is caused by elevation in amount of Si-OH groups, removal of contaminants on the wafer surface, the enhancement of viscous flow of the surface layer and the enhanced diffusivity of water and gas trapped at the interface. [2]

  5. Surface activated bonding - Wikipedia

    en.wikipedia.org/wiki/Surface_activated_bonding

    Surface activated bonding (SAB) is a non-high-temperature wafer bonding technology with atomically clean and activated surfaces. Surface activation prior to bonding by using fast atom bombardment is typically employed to clean the surfaces.

  6. Glass frit bonding - Wikipedia

    en.wikipedia.org/wiki/Glass_frit_bonding

    The exact positioning of the screen print structures to the cap wafer are required to ensure an accurate bond. The bonded structures are, dependent on the wettability of the printed surface, 10 to 20% wider than the designed screen. [5] To ensure a uniform glass thickness, all structures should have the same width.

  7. Composite repair - Wikipedia

    en.wikipedia.org/wiki/Composite_repair

    The most important technical challenges in the implementation of a successful composite patch repair are: (a) proper design of the repair patch and the procedures that will be followed, (b) selection of the most suitable materials and tools for the application, (c) careful surface preparation, (d) implementation of the composite patch repair ...

  8. AOL Mail

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    Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!

  9. Mordant - Wikipedia

    en.wikipedia.org/wiki/Mordant

    Mordant red 19 is a typical mordant dye. Like many mordant dyes, it features the azo group (RN=NR) and various sites for chelating to metal cations. A French Indienne, a printed or painted textile in the manner of Indian productions, which used mordants to fix the dyes