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2. Materials for use in vacuum - Wikipedia

   en.wikipedia.org/wiki/Materials_for_use_in_vacuum

   304 stainless steel is a common choice of a stainless steel. 304L stainless steel, a low-carbon variant of 304 steel, is used for ultra-high vacuum systems. 316L stainless steel a low-carbon and low-magnetic stainless steel, used in accelerator technologies. 347 stainless steel does not accept high polish. 321 stainless steel is chosen when low ...

3. Direct bonding - Wikipedia

   en.wikipedia.org/wiki/Direct_bonding

   The procedural steps of the direct bonding process of wafers any surface is divided into wafer preprocessing, pre-bonding at room temperature and; annealing at elevated temperatures. Even though direct bonding as a wafer bonding technique is able to process nearly all materials, silicon is the most established material up to now. Therefore, the ...

4. Solvent bonding - Wikipedia

   en.wikipedia.org/wiki/Solvent_bonding

   Solvent bonding differs from adhesive bonding, because the solvent does not become a permanent addition to the joined substrate. [4] Solvent bonding differs from other plastic welding processes in that heating energy is generated by the chemical reaction between the solvent and thermoplastic, and cooling occurs during evaporation of the solvent ...

5. Glass-to-metal seal - Wikipedia

   en.wikipedia.org/wiki/Glass-to-metal_seal

   Uranium glass used as lead-in seals in a vacuum capacitor. Glass-to-metal seals are a type of mechanical seal which joins glass and metal surfaces. They are very important elements in the construction of vacuum tubes, electric discharge tubes, incandescent light bulbs, glass-encapsulated semiconductor diodes, reed switches, glass windows in metal cases, and metal or ceramic packages of ...

6. Passivation (chemistry) - Wikipedia

   en.wikipedia.org/wiki/Passivation_(chemistry)

   In physical chemistry and engineering, passivation is coating a material so that it becomes "passive", that is, less readily affected or corroded by the environment. . Passivation involves creation of an outer layer of shield material that is applied as a microcoating, created by chemical reaction with the base material, or allowed to build by spontaneous oxidation

7. Adhesive bonding of semiconductor wafers - Wikipedia

   en.wikipedia.org/wiki/Adhesive_bonding_of...

   Adhesive bonding with organic materials such as BCB or SU-8 has simple process properties and the ability to form high-aspect ratio micro structures. The bonding procedure is based on polymerization reaction of organic molecules to form long polymer chains during annealing. This cross-link reaction forms BCB and SU-8 to a solid polymer layer. [3]

8. Stainless steel - Wikipedia

   en.wikipedia.org/wiki/Stainless_steel

   Stainless steel, also known as inox, corrosion-resistant steel (CRES), or rustless steel, is an iron-based alloy containing a minimum level of chromium that is resistant to rusting and corrosion. Stainless steel's resistance to corrosion results from the 10.5% or more chromium content, which forms a passive film that can protect the material ...

9. Hermetic seal - Wikipedia

   en.wikipedia.org/wiki/Hermetic_seal

   Certain epoxy resins and their processes can create a hermetic bond to copper, brass, stainless steel, specialty alloys, plastic, or epoxy itself with similar coefficients of thermal expansion, and are used in the manufacture of hermetic electrical and fiber optic hermetic seals. Epoxy-based seals can increase signal density within a ...