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IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
IEEE 200-1975 or "Standard Reference Designations for Electrical and Electronics Parts and Equipments" is a standard that was used to define referencing naming systems for collections of electronic equipment. IEEE 200 was ratified in 1975. The IEEE renewed the standard in the 1990s, but withdrew it from active support shortly thereafter.
The IPC preferred term for an assembled board is circuit card assembly (CCA), [19] and for an assembled backplane it is backplane assembly. "Card" is another widely used informal term for a "printed circuit assembly". For example, expansion card. A PCB may be printed with a legend identifying the components, test points, or identifying
IPC (electronics), an international trade association for the printed-board and electronics assembly industries; IPC Systems, a firm providing communication systems for financial markets; Idaho Power Company, an American utility; International Paralympic Committee, an international non-profit organisation of elite sports for athletes with ...
An electrical component that stores energy in an electric field. capacitor-input filter A power supply network where a capacitor is the first element following the rectifier. capacitor voltage transformer In electrical power systems, an instrument transformer for measuring voltage that uses a capacitive voltage divider. capacity factor
Through-hole technology uses holes drilled through the printed circuit board (PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB. Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.
SMEMA is an acronym for the Surface Mount Equipment Manufacturers Association. In 1999 they merged with the IPC to form the IPC SMEMA Council. [1] One standard they have is for the wiring of communications between Surface mount technology producing machinery such as a Stencil Printer or a Pick and Place Machine on an Electronics production line ...
At the electronic component level, this translates to components with increased I/Os with smaller footprint areas (e.g. flip-chip packages, chip-scale packages, and direct chip attachments), and on the printed circuit board and package substrate level, to the use of high density interconnects (HDIs) (e.g. finer lines and spaces, and smaller vias).
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