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There are other evaluation methods that have lower demands on the calibration coefficients and on the evaluation process itself. These include the average stress method and the incremental strain method. Both the methods are based on the assumption that the change in deformation is caused solely by the relieved stress on the drilled increment.
The strain hardening exponent (also called the strain hardening index), usually denoted , is a measured parameter that quantifies the ability of a material to become stronger due to strain hardening. Strain hardening (work hardening) is the process by which a material's load-bearing capacity increases during plastic (permanent) strain , or ...
The Hopkinson pressure bar was first suggested by Bertram Hopkinson in 1914 [1] as a way to measure stress pulse propagation in a metal bar. Later, in 1949 Herbert Kolsky [2] refined Hopkinson's technique by using two Hopkinson bars in series, now known as the split-Hopkinson bar, to measure stress and strain, incorporating advancements in the cathode ray oscilloscope in conjunction with ...
The condition of a fiber-reinforced composite under applied tensile stress along the direction of the fibers can be decomposed into four stages from small strain to large strain. Since the stress is parallel to the fibers, the deformation is described by the isostrain condition, i.e., the fiber and matrix experience the same strain.
The strain can be decomposed into a recoverable elastic strain (ε e) and an inelastic strain (ε p). The stress at initial yield is σ 0 . Work hardening , also known as strain hardening , is the process by which a material's load-bearing capacity (strength) increases during plastic (permanent) deformation.
In microbiology, streaking is a technique used to isolate a pure strain from a single species of microorganism, often bacteria. Samples can then be taken from the resulting colonies and a microbiological culture can be grown on a new plate so that the organism can be identified, studied, or tested.
Strain can be induced in thin films with either epitaxial growth, or more recently, topological growth. Epitaxial strain in thin films generally arises due to lattice mismatch between the film and its substrate and triple junction restructuring at the surface triple junction, which arises either during film growth or due to thermal expansion mismatch. [5]
This is not true since the actual area will decrease while deforming due to elastic and plastic deformation. The curve based on the original cross-section and gauge length is called the engineering stress–strain curve, while the curve based on the instantaneous cross-section area and length is called the true stress–strain curve. Unless ...