Ad
related to: characteristics of surface mount technologytemu.com has been visited by 1M+ users in the past month
- Top Sale Items
Daily must-haves
Special for you
- Store Locator
Team up, price down
Highly rated, low price
- Men's Clothing
Limited time offer
Hot selling items
- Jaw-dropping prices
Countless Choices For Low Prices
Up To 90% Off For Everything
- Top Sale Items
Search results
Results from the WOW.Com Content Network
Surface-mount technology was developed in the 1960s. By 1986, surface-mounted components accounted for 10% of the market at most but were rapidly gaining popularity. [4] By the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices.
Although surface-mount, these devices require specific process for assembly. Chip-on-board (COB) , a bare silicon chip, that is usually an integrated circuit, is supplied without a package (which is usually a lead frame overmolded with epoxy ) and is attached, often with epoxy, directly to a circuit board.
A stud grid array (SGA) is a short-pinned pin grid array chip scale package for use in surface-mount technology. The polymer stud grid array or plastic stud grid array was developed jointly by the Interuniversity Microelectronics Centre (IMEC) and Laboratory for Production Technology, Siemens AG. [4] [5]
Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s, and became widely used by the mid-1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes.
Metal electrode leadless face (MELF) is a type of leadless cylindrical electronic surface mount device package with metal end terminals. Diodes and resistors are the most common MELF devices. [1] The EN 140401-803 and JEDEC DO-213 standards describe multiple MELF components. [2]
Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface ...
Surface mount components are placed along the front (and often back) faces of the machine. Most components are supplied on paper or plastic tape, in tape reels that are loaded onto feeders mounted to the machine. Larger integrated circuits (ICs) are sometimes supplied and arranged in trays which are stacked in a compartment. More commonly used ...
LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
Ad
related to: characteristics of surface mount technologytemu.com has been visited by 1M+ users in the past month