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  2. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  3. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

  4. Thermal management of high-power LEDs - Wikipedia

    en.wikipedia.org/wiki/Thermal_management_of_high...

    Heat pipes may also be added to aluminum or copper heat sinks to reduce spreading resistance. Shape – Thermal transfer takes place at the surface of the heat sink. Therefore, heat sinks should be designed to have a large surface area. This goal can be reached by using a large number of fine fins or by increasing the size of the heat sink itself.

  5. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...

  6. Arctic Silver - Wikipedia

    en.wikipedia.org/wiki/Arctic_Silver

    Arctic Silver Inc. is a privately owned engineering corporation which develops and manufactures thermally conductive compounds and thermal adhesives for the application of heat sinks to high-powered electronic components such as processors, LEDs, chipsets and other electronic devices.

  7. Deep water source cooling - Wikipedia

    en.wikipedia.org/wiki/Deep_water_source_cooling

    Deep water source cooling (DWSC) or deep water air cooling is a form of air cooling for process and comfort space cooling which uses a large body of naturally cold water as a heat sink. It uses water at 4 to 10 degrees Celsius drawn from deep areas within lakes, oceans, aquifers or rivers, which is pumped through the one side of a heat exchanger .

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