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In computing, a memory module or RAM stick is a printed circuit board on which memory integrated circuits are mounted. [ 1 ] Memory modules permit easy installation and replacement in electronic systems, especially computers such as personal computers , workstations , and servers .
A 16GB [1] DDR4 SO-DIMM module by Micron. DDR4 memory is supplied in 288-pin dual in-line memory modules (DIMMs), similar in size to 240-pin DDR3 DIMMs. DDR4 RAM modules feature pins that are spaced more closely at 0.85 mm compared to the 1.0 mm spacing in DDR3, allowing for a higher pin density within the same standard DIMM length of 133.35 mm ...
DDR2 is a 240-pin module, DDR is a 184-pin module. Notebooks have 200-pin SO-DIMMs for DDR and DDR2; however, the notch on DDR2 modules is in a slightly different position than on DDR modules. Higher-speed DDR2 DIMMs can be mixed with lower-speed DDR2 DIMMs, although the memory controller will operate all DIMMs at same speed as the lowest-speed ...
Rambus announced a working DDR5 dual in-line memory module (DIMM) in September 2017. [9] [10] On November 15, 2018, SK Hynix announced completion of its first DDR5 RAM chip; running at 5.2 GT/s at 1.1 V. [11] In February 2019, SK Hynix announced a 6.4 GT/s chip, the highest speed specified by the preliminary DDR5 standard. [12]
Unlike the SDRAM manufacturers that released their SDRAM as bare modules, the Patriot Memory modules featured a bladed metal heat shielding across the entire DDR module. [3] Patriot Memory continued the use of full module heat sinks across each generation of DDR generations to include DDR4. The Patriot Memory brand eventually became the company ...
The number of chips is a multiple of 8 for non-ECC modules and a multiple of 9 for ECC modules. Chips can occupy one side (single sided) or both sides (dual sided) of the module. The maximal number of chips per DDR module is 36 (9×4) for ECC and 32 (8x4) for non-ECC. ECC vs non-ECC Modules that have error-correcting code are labeled as ECC.
Solid-state hard drives have continued to increase in speed, from ~400 Mbit/s via SATA3 in 2012 up to ~7 GB/s via NVMe/PCIe in 2024, closing the gap between RAM and hard disk speeds, although RAM continues to be an order of magnitude faster, with single-lane DDR5 8000MHz capable of 128 GB/s, and modern GDDR even faster.
The main determinant of a memory system's cost is the density of the components used to make it up. Smaller components, and fewer of them, mean that more "cells" can be packed onto a single chip, which in turn means more can be produced at once from a single silicon wafer.
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