enow.com Web Search

  1. Ad

    related to: wlp primers

Search results

  1. Results from the WOW.Com Content Network
  2. Wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Wafer-level_packaging

    Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still ...

  3. Fan-out wafer-level packaging - Wikipedia

    en.wikipedia.org/wiki/Fan-out_wafer-level_packaging

    By contrast, in standard WLP flows integrated circuits are packaged while still part of the wafer, and the wafer (with outer layers of packaging already attached) is diced afterwards; the resulting package is practically of the same size as the die itself. However, the advantage of having a small package comes with a downside of limiting the ...

  4. Embedded wafer level ball grid array - Wikipedia

    en.wikipedia.org/wiki/Embedded_Wafer_Level_Ball...

    eWLB is a further development of the classical wafer level ball grid array technology (WLB or WLP: wafer level package). The main driving force behind the eWLB technology was to allow fanout and more space for interconnect routing. All process steps for the generation of the package are performed on the wafer.

  5. WLP - Wikipedia

    en.wikipedia.org/wiki/WLP

    The initials WLP may stand for several things, such as the following: Wafer-level packaging, a type of integrated circuit (microchip) packaging; Weakest liberal precondition, a computer programming concept; WebSphere Liberty Profile, a computer software version; Windows Logo Program, a Microsoft Windows branding and certification program

  6. Lam Research - Wikipedia

    en.wikipedia.org/wiki/Lam_Research

    Lam Research Corporation is an American supplier of wafer-fabrication equipment and related services to the semiconductor industry. [2] Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices (transistors, capacitors) and their wiring (interconnects).

  7. Lead styphnate - Wikipedia

    en.wikipedia.org/wiki/Lead_styphnate

    Lead styphnate (lead 2,4,6-trinitroresorcinate, C 6 HN 3 O 8 Pb ), whose name is derived from styphnic acid, is an explosive used as a component in primer and detonator mixtures for less sensitive secondary explosives. Lead styphnate is only slightly soluble in water and methanol. [3]

  8. Mercury (II) fulminate - Wikipedia

    en.wikipedia.org/wiki/Mercury(II)_fulminate

    The reduced mercury which results forms amalgams with cartridge brass, weakening it, as well. Today, mercury fulminate has been replaced in primers by more efficient chemical substances. These are non-corrosive, less toxic, and more stable over time; they include lead azide, lead styphnate, and tetrazene derivatives.

  9. Random hexamer - Wikipedia

    en.wikipedia.org/wiki/Random_hexamer

    A random hexamer or random hexonucleotides are for various PCR applications such as rolling circle amplification to prime the DNA.. They are oligonucleotide sequences of 6 bases which are synthesised entirely randomly to give a numerous range of sequences that have the potential to anneal at many random points on a DNA sequence and act as a primer to commence first strand cDNA synthesis.

  1. Ad

    related to: wlp primers