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H 2 Ceramic cooling (also called H 2 C or Hot-to-Cold) is a computer cooling product offered as an option in Dell's XPS gaming systems, advertised specifically as facilitating CPU overclocking. H 2 C is a two-stage Liquid/Thermoelectric (TEC) hybrid cooling system that combines a liquid-to-air heat exchanger (much like a liquid radiator), a ...
The former pertains to the category that utilizes cold plate cooling, which uses water as coolant while, in the latter (also referred to as liquid immersion cooling), the surface of the chips comes in contact with the liquid since there is no wall separating the heat source from the coolant. [2] This immersion cooling also offer a higher ...
A small blower fan is used to direct air across a laptop computer's CPU cooler. A case fan may be mounted on a radiator attached to the case, simultaneously operating to cool a liquid cooling device's working fluid and to ventilate the case. In laptops, a single blower fan often cools a heat sink connected to both CPU and GPU using heat pipes.
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Immersion cooling is an IT cooling practice by which servers are completely or partially immersed in a dielectric fluid that has significantly higher thermal conductivity than air. Heat is removed from the system by putting the coolant in direct contact with hot components, and circulating the heated liquid through heat exchangers.
To the right is a smaller heat sink cooling another integrated circuit of the motherboard. Typical heatsink-fan combination found on a consumer laptop. The heatpipes which contain a working fluid make direct contact with the CPU and GPU, conducting heat away from the component and transferring it to the fin-stack mounted on the exhaust port of ...
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