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  2. Electrophoretic deposition - Wikipedia

    en.wikipedia.org/wiki/Electrophoretic_deposition

    The cathodic process results in considerably more gas being trapped within the film than the anodic process. Since the gas has a higher electrical resistance than either depositing film or the bath itself, the amount of gas has a significant effect on the current at a given applied voltage. This is why cathodic processes are often able to be ...

  3. Electroplating - Wikipedia

    en.wikipedia.org/wiki/Electroplating

    Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current.

  4. Chemical bath deposition - Wikipedia

    en.wikipedia.org/wiki/Chemical_bath_deposition

    Chemical Bath Deposition has a long history but until recently was an uncommon method of thin-film deposition. [1]In 1865, Justus Liebig published an article describing the use of Chemical Bath Deposition to silver mirrors (to affix a reflective layer of silver to the back of glass to form a mirror), [5] though in the modern day electroplating and vacuum deposition are more common.

  5. Electrodeposition - Wikipedia

    en.wikipedia.org/wiki/Electrodeposition

    Electrophoretic deposition, a term for a broad range of industrial processes which includes electrocoating, e-coating, cathodic electrodeposition, anodic electrodeposition and electrophoretic coating, or electrophoretic painting

  6. Plasma electrolytic oxidation - Wikipedia

    en.wikipedia.org/wiki/Plasma_electrolytic_oxidation

    The part to be coated is immersed in a bath of electrolyte which usually consists of a dilute alkaline solution such as KOH. It is electrically connected, so as to become one of the electrodes in the electrochemical cell, with the other "counter-electrode" typically being made from an inert material such as stainless steel, and often consisting of the wall of the bath itself.

  7. Electroless nickel-phosphorus plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Before plating, the surface of the material must be thoroughly cleaned. Unwanted solids left on the surface cause poor plating. Cleaning is usually achieved by a series of chemical baths, including non-polar solvents to remove oils and greases, as well as acids and alkalis to remove oxides, insoluble organics, and other surface contaminants.

  8. Copper electroplating - Wikipedia

    en.wikipedia.org/wiki/Copper_electroplating

    Orthophosphate ions decrease bath throwing power and deposit ductility at concentrations above 40–60 g/L, and they lead to lower solution conductivity, banded deposits, and lower bright current density range at concentrations beyond 100 g/L. Orthophosphate is removed from the bath by either doing partial bails and dilutions or by completely ...

  9. Copper–copper (II) sulfate electrode - Wikipedia

    en.wikipedia.org/wiki/Copper–copper(II)_sulfate...

    This reaction characterized by reversible and fast electrode kinetics, [3] meaning that a sufficiently high current can be passed through the electrode with the 100% efficiency of the redox reaction (dissolution of the metal or cathodic deposition of the copper-ions).