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The bond forms because the adhesive is soft enough to flow (i.e., "wet") to the adherend. The bond has strength because the adhesive is hard enough to resist flow when stress is applied to the bond. Once the adhesive and the adherend are in close proximity, molecular interactions, such as van der Waals forces , become involved in the bond ...
A weaker bond is formed if a hydrogen atom in one molecule is attracted to an atom of nitrogen, oxygen, or fluorine in another molecule, a phenomenon called hydrogen bonding. Chemical adhesion occurs when the surface atoms of two separate surfaces form ionic, covalent, or hydrogen bonds.
Male bonding; Channel bonding (or modem bonding), an arrangement in which two or more network interfaces on a host computer are combined NIC bonding, an alternate name for link aggregation; Electrical bonding, practice of connecting all metal objects in a room to protect from electric shock; Bonding, a method for creating electric interconnects:
Other umbrella terms used to describe the concept include trunking, [1] bundling, [2] bonding, [1] channeling [3] or teaming. Implementation may follow vendor-independent standards such as Link Aggregation Control Protocol (LACP) for Ethernet , defined in IEEE 802.1AX or the previous IEEE 802.3ad , but also proprietary protocols .
A bond that involves the sharing of electron pairs between atoms. The stable balance of attractive and repulsive forces that occurs between atoms when they share electrons is known as covalent bonding. A diatomic hydrogen molecule, H 2 (right), is formed by a covalent bond when two single hydrogen atoms share two electrons between them ...
Electrical bonding is the practice of intentionally electrically connecting all exposed metal items not designed to carry electricity in a room or building as protection from electric shock. Bonding is also used to minimize electrical arcing between metal surfaces with electrical potential differences.
Chelation (/ k iː ˈ l eɪ ʃ ən /) is a type of bonding of ions and their molecules to metal ions. It involves the formation or presence of two or more separate coordinate bonds between a polydentate (multiple bonded) ligand and a single central metal atom.
Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, ...