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Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...
These first Heisler–Gröber charts were based upon the first term of the exact Fourier series solution for an infinite plane wall: (,) = = [ + ], [1]where T i is the initial uniform temperature of the slab, T ∞ is the constant environmental temperature imposed at the boundary, x is the location in the plane wall, λ is the root of λ * tan λ = Bi, and α is thermal diffusivity.
sc is a cross-platform, free, TUI, spreadsheet and calculator application that runs on Unix and Unix-like operating systems. It has also been ported to Windows. It can be accessed through a terminal emulator, and has a simple interface and keyboard shortcuts resembling the key bindings of the Vim text editor. It can be used in a similar manner ...
LibreOffice Calc is the spreadsheet component of the LibreOffice software package. [5] [6]After forking from OpenOffice.org in 2010, LibreOffice Calc underwent a massive re-work of external reference handling to fix many defects in formula calculations involving external references, and to boost data caching performance, especially when referencing large data ranges.
The thermal conductivity of a material is a measure of its ability to conduct heat.It is commonly denoted by , , or and is measured in W·m −1 ·K −1.. Heat transfer occurs at a lower rate in materials of low thermal conductivity than in materials of high thermal conductivity.
In a cross-flow, in which one system, usually the heat sink, has the same nominal temperature at all points on the heat transfer surface, a similar relation between exchanged heat and LMTD holds, but with a correction factor. A correction factor is also required for other more complex geometries, such as a shell and tube exchanger with baffles.
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Heatsink mounted on a motherboard, cooling the CPU underneath it. This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power ( TDP ), also known as thermal design point , is the maximum amount of heat that a computer component (like a CPU , GPU or system on a chip ) can generate and that its cooling ...