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A part failure mode is the way in which a component failed "functionally" on the component level. Often a part has only a few failure modes. For example, a relay may fail to open or close contacts on demand. The failure mechanism that caused this can be of many different kinds, and often multiple factors play a role at the same time.
Physics of failure is a technique under the practice of reliability design that leverages the knowledge and understanding of the processes and mechanisms that induce failure to predict reliability and improve product performance.
Failure cause and/or mechanism Defects in requirements, design, process, quality control, handling or part application, which are the underlying cause or sequence of causes that initiate a process (mechanism) that leads to a failure mode over a certain time. A failure mode may have more causes.
Material failure theory is an interdisciplinary field of materials science and solid mechanics which attempts to predict the conditions under which solid materials fail under the action of external loads. The failure of a material is usually classified into brittle failure or ductile failure .
Metallurgical failure analysis is the process to determine the mechanism that has caused a metal component to fail.It can identify the cause of failure, providing insight into the root cause and potential solutions to prevent similar failures in the future, as well as culpability, which is important in legal cases. [1]
Time-dependent gate oxide breakdown (or time-dependent dielectric breakdown, TDDB) is a kind of transistor aging, a failure mechanism in MOSFETs, when the gate oxide breaks down as a result of long-time application of relatively low electric field (as opposed to immediate breakdown, which is caused by strong electric field).
In order to reduce failures, a precise knowledge of bond strength quality measurement during product design and subsequent manufacture is of vital importance. The best place to start is with the failure mode. This is based on the assumption that there is a particular failure mode, or range of modes, that may occur within a product.
Failure mechanisms of electronic semiconductor devices fall in the following categories Material-interaction-induced mechanisms. Stress-induced mechanisms. Mechanically induced failure mechanisms. Environmentally induced failure mechanisms.