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The term "hot electron" comes from the effective temperature term used when modelling carrier density (i.e., with a Fermi-Dirac function) and does not refer to the bulk temperature of the semiconductor (which can be physically cold, although the warmer it is, the higher the population of hot electrons it will contain all else being equal).
The heat dissipation in integrated circuits problem has gained an increasing interest in recent years due to the miniaturization of semiconductor devices. The temperature increase becomes relevant for cases of relatively small-cross-sections wires, because such temperature increase may affect the normal behavior of semiconductor devices.
Furthermore, lattice vibrations increase with temperature, which increases the effect of electron scattering. Additionally, the number of charge carriers within a semiconductor will increase, as more carriers have the energy required to cross the band-gap threshold and so conductivity of semiconductors also increases with increasing temperature ...
The efficiency of a thermoelectric device for electricity generation is given by , defined as =.. The maximum efficiency of a thermoelectric device is typically described in terms of its device figure of merit where the maximum device efficiency is approximately given by [7] = + ¯ + ¯ +, where is the fixed temperature at the hot junction, is the fixed temperature at the surface being cooled ...
Junction temperature, short for transistor junction temperature, [1] is the highest operating temperature of the actual semiconductor in an electronic device. In operation, it is higher than case temperature and the temperature of the part's exterior.
At the atomic scale, a temperature gradient causes charge carriers in the material to diffuse from the hot side to the cold side. This is due to charge carrier particles having higher mean velocities (and thus kinetic energy) at higher temperatures, leading them to migrate on average towards the colder side, in the process carrying heat across the material.
Effect of temperature on the current-voltage characteristics of a solar cell Temperature affects the characteristic equation in two ways: directly, via T in the exponential term, and indirectly via its effect on I 0 (strictly speaking, temperature affects all of the terms, but these two far more significantly than the others).
The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers ...