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Bioconcentration. In aquatic toxicology, bioconcentration is the accumulation of a water-borne chemical substance in an organism exposed to the water. [ 1][ 2] There are several ways in which to measure and assess bioaccumulation and bioconcentration. These include: octanol-water partition coefficients (K OW ), bioconcentration factors (BCF ...
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Tris (pentafluorophenyl)borane, sometimes referred to as "BCF", is the chemical compound (C6F5)3B. It is a white, volatile solid. The molecule consists of three pentafluorophenyl groups attached in a "paddle-wheel" manner to a central boron atom; the BC3 core is planar. It has been described as the “ideal Lewis acid ” because of its high ...
The Variant Call Format or VCF is a standard text file format used in bioinformatics for storing gene sequence variations. The format was developed in 2010 for the 1000 Genomes Project and has since been used by other large-scale genotyping and DNA sequencing projects. [ 1][ 2] VCF is a common output format for variant calling programs due to ...
The Biopharmaceutics Classification System (BCS) is a system to differentiate drugs on the basis of their solubility and permeability. [1] This system restricts the prediction using the parameters solubility and intestinal permeability. The solubility classification is based on a United States Pharmacopoeia (USP) aperture.
Bromochlorodifluoromethane (BCF), also referred to by the code numbers Halon 1211 and Freon 12B1, is a haloalkane with the chemical formula C F 2 Cl Br. It is used for fire suppression, especially for expensive equipment or items that could be damaged by the residue from other types of extinguishers. [ 1 ]
The lifetime of a particle is given by the inverse of its decay rate, , the probability per unit time that the particle will decay. For a particle of a mass M and four-momentum P decaying into particles with momenta p i {\displaystyle p_{i}} , the differential decay rate is given by the general formula (expressing Fermi's golden rule )
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress of solder as a result of repeated temperature fluctuations, mechanical vibrations, or mechanical loads. Techniques to evaluate solder fatigue behavior include finite element analysis and ...