Ad
related to: easy way to remove solder from gold
Search results
Results from the WOW.Com Content Network
A typical spring-loaded solder sucker A solder sucker partially dismantled showing the spring. A desoldering pump, colloquially known as a solder sucker, is a manually-operated device which is used to remove solder from a printed circuit board. There are two types: the plunger style and bulb style. [1]
With the karat gold this low (6K), and over medium high heat, the dilute nitric acid will dissolve the Sterling silver (and other base metals in the karat gold) starting on the outside surface of the 6K gold alloy, working its way into the gold alloy, forming a honeycomb structure as it works its way into the metals.
"Hard soldering" or "silver soldering" is used to join precious and semi-precious metals such as gold, silver, brass, and copper. The solder is usually described as easy, medium, or hard in reference to its melting temperature, not the strength of the joint. Extra-easy solder contains 56% silver and has a melting point of 618 °C (1,145 °F).
On gold surfaces gold-indium intermetallics tend to be formed, and the joint then fails in the gold-depleted zone and the gold-rich intermetallic. [37] Less gold dissolution and more ductile than lead-tin alloys. [12] Good thermal fatigue properties. Pb 60 In 40: 195: 225 [16] Pb: No: In40. Low gold-leaching. Good thermal fatigue properties. Pb ...
The remaining solder types are used in decreasing order of hardness during the process of making an item, to prevent a previously soldered seam or joint desoldering while additional sites are soldered. Easy solder or repair solder are also often used for repair work for the same reason. Flux is also used to prevent joints from desoldering.
Both quantitative and qualitative tests for solderability exist. [6] The two most common testing methods are the 'dip and look' method and wetting balance analysis.In both of these tests, the soldered pieces undergo an accelerated aging process before being tested for solderability, to take into consideration the time a component was in storage prior to mounting to final assembly.
Pickling is a metal surface treatment used to remove impurities, such as stains, inorganic contaminants, and rust or scale from ferrous metals, copper, precious metals and aluminium alloys. [1] A solution called pickle liquor , which usually contains acid , is used to remove the surface impurities.
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]
Ad
related to: easy way to remove solder from gold