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The field strength at which break down occurs is an intrinsic property of the material called its dielectric strength. In practical electric circuits electrical breakdown is often an unwanted occurrence, a failure of insulating material causing a short circuit , resulting in a catastrophic failure of the equipment.
In air at STP the mean free path of molecules is about 96 nm. Since electrons are much smaller, their average distance between colliding with molecules is about 5.6 times longer, or about 0.5 μm. This is a substantial fraction of the 7.5 μm spacing between the electrodes for minimal arc voltage.
The relative permittivity (in older texts, dielectric constant) is the permittivity of a material expressed as a ratio with the electric permittivity of a vacuum. A dielectric is an insulating material, and the dielectric constant of an insulator measures the ability of the insulator to store electric energy in an electrical field.
Another common term encountered for both absolute and relative permittivity is the dielectric constant which has been deprecated in physics and engineering [2] as well as in chemistry. [ 3 ] By definition, a perfect vacuum has a relative permittivity of exactly 1 whereas at standard temperature and pressure , air has a relative permittivity of ...
Electrical breakdown in an electric discharge showing the ribbon-like plasma filaments from a Tesla coil.. In electronics, electrical breakdown or dielectric breakdown is a process that occurs when an electrically insulating material (a dielectric), subjected to a high enough voltage, suddenly becomes a conductor and current flows through it.
In electricity (electromagnetism), the electric susceptibility (; Latin: susceptibilis "receptive") is a dimensionless proportionality constant that indicates the degree of polarization of a dielectric material in response to an applied electric field. The greater the electric susceptibility, the greater the ability of a material to polarize in ...
For high voltage applications, a good dielectric gas should have high dielectric strength, high thermal stability and chemical inertness against the construction materials used, non-flammability and low toxicity, low boiling point, good heat transfer properties, and low cost. [1] The most common dielectric gas is air, due to its ubiquity and ...
Various methods may be employed to create voids or pores in a silicon dioxide dielectric. [3] Voids can have a relative dielectric constant of nearly 1, thus the dielectric constant of the porous material may be reduced by increasing the porosity of the film. Relative dielectric constants lower than 2.0 have been reported.