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If a product is on a large load-bearing area, the cushion may not deform and will not cushion the shock. If the load-bearing area is too small, the product may “bottom out” during a shock; the shock is not cushioned. Engineers use “cushion curves” to choose the best thickness and load-bearing area for a cushioning material.
The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm × 0.125 mm (0.0098 in × 0.0049 in), [ 31 ] but the imperial 01005 name is already being used for the 0.4 mm × 0.2 mm (0.0157 in ...
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge .
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package ", supports the electrical contacts which connect the device to a circuit board.
LGA 1700 socket on a motherboard. The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). [1]
Form factor is a hardware design aspect that defines and prescribes the size, shape, and other physical specifications of components, particularly in electronics. [ 1 ] [ 2 ] A form factor may represent a broad class of similarly sized components, or it may prescribe a specific standard.
The DTX form factor is a variation of ATX specification [1] designed especially for small form factor PCs (especially for HTPCs) with dimensions of 8 × 9.6 inches (203 × 244 mm). [2] An industry standard intended to enable interchangeability for systems similar to Shuttle's original "SFF" designs, [3] AMD announced its development on January ...
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat.