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The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.
Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply ...
Vishay Semiconductor have released 20W resistors in TO-220 form. so this indicates the expected heat dissipation of the package with a heatsink. source: "TPR Thick Film Technology 20 Watt Power Resistors TO-220 Package". there are 50W zeners in TO-3, and 10W in DO-4, 100W in DO-5 (for comparison). Charlieb000 21:22, 3 August 2012 (UTC)
Size comparison of BJT transistor packages, from left to right: SOT-23, TO-92, TO-126, TO-3 3D model of TO-3 package. In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits.
It is used in switching power supplies in high-power applications: variable-frequency drives (VFDs) for motor control in electric cars, trains, variable-speed refrigerators, and air conditioners, as well as lamp ballasts, arc-welding machines, photovoltaic and hybrid inverters, uninterruptible power supply systems (UPS), and induction stoves.
The coefficient of performance or COP (sometimes CP or CoP) of a heat pump, refrigerator or air conditioning system is a ratio of useful heating or cooling provided to work (energy) required. [ 1 ] [ 2 ] Higher COPs equate to higher efficiency, lower energy (power) consumption and thus lower operating costs.
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[1] [2] They are similar to the earlier TO-220-style packages intended for high power dissipation [2] [4] but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can ...
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