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USB Tweezers performing cold bump pull (CPB) on a bond tester. Measuring bond strength by pull testing is often the best way to get the failure mode in which you are interested. Additionally, and unlike a shear test, as the bond separates, the fracture surfaces are pulled away from each other, cleanly enabling accurate failure mode analysis.
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Wafer testing is a step performed during semiconductor device fabrication after back end of line (BEOL) and before IC packaging.. Two types of testing are typically done. Very basic wafer parametric tests (WPT) are performed at a few locations on each wafer to ensure the wafer fabrication process has been carried out successfully.
Crimp tool for 0.14 mm 2 to 10 mm 2 (26–8 AWG) insulated and non-insulated ferrules. Crimping is a method of joining two or more pieces of metal or other ductile material by deforming one or both of them to hold the other. The bend or deformity is called the crimp. [1] [2] Crimping tools are used to create crimps.
A proof mark is a mark specific to the manufacturer, importer, or testing facility that is performing the test. [12] It generally takes the form of a stamp that makes an impression in the metal. Since proof marks are unique and nearly universal, they are often used to identify the origins of firearms that lack normal manufacturer's markings ...
A receptacle tester being used to check for some types of improper wiring of an outlet. For this particular tester, proper wiring is indicated by the two yellow lights. The outlet tester checks that each contact in the outlet appears to be connected to the correct wire in the building's electrical wiring. It can identify several common wiring ...
A pull-off test, also called stud pull test, is a type of test in which an adhesive connection is made between a stud and a carrier (or object to be tested) by using a glue, possibly an epoxy or polyester resin, that is stronger than the bond that needs to be tested.
A bond tester is a scientific instrument used to measure the mechanical strength of bonds, evaluate bond strength distributions or determine compliance with specified bond strength requirements of the applicable acquisition document.
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