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Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
The thickness of gold plating on jewellery is noted in microns (or micro-meters). The microns of thickness determines how long the gold plating lasts with usage. The jewellery industry denotes different qualities of gold plating in the following terminology Gold flashed / Gold washed - gold layer thickness less than 0.5 micron
Through-hole devices mounted on the circuit board of a mid-1980s home computer.Axial-lead devices are at upper left, while blue radial-lead capacitors are at upper right Close-up view of an electronic circuit board showing component lead holes (gold-plated) with through-hole plating up the sides of the hole to connect tracks on both sides of the board.
Electroless nickel plating, covered by a thin layer of gold, is used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improving the solderability of copper contacts and plated through holes and vias. The gold is typically applied by quick immersion in a solution containing gold salts.
PCB via current capacity chart showing 1 mil plating via current capacity & resistance versus diameter on a 1.6 mm PCB. In printed circuit board (PCB) design, a via consists of two pads in corresponding positions on different copper layers of the board, that are electrically connected by a hole through the board.
By voting Trump back into office, voters “soundly repudiated Biden’s radical open borders policies” that “made less Americans safe,” said Texas State Rep. Brian Harrison.
Here's what happened and how he fought back. This NC man was slapped with almost $1,000 in toll fees from 3 states he didn’t even drive in — fraudster illegally copied his license plate.
Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [19]