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There are three major requirements of creating a desirable surface for adhesive bonding of plastics: the weak boundary layer of the given material must be removed or chemically modified to create a strong boundary layer; the surface energy of the adherend should be higher than the surface energy of the adhesive for good wetting; and the surface profile can be improved to provide mechanical ...
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS ...
Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1] These requirements are specified for the wafer surface as sufficiently clean, flat and smooth.
Anodic bonding is commonly used to seal glass to silicon wafers in electronics and microfluidics. Anodic bonding, also known as field assisted bonding or electrostatic sealing, [1] is mostly used for connecting silicon/glass and metal/glass through electric fields. The requirements for anodic bonding are clean and even wafer surfaces and atomic ...
Detlef Symietz, Andreas Lutz: Structural bonding in vehicle construction. Properties, applications and performance of a new joining process. (= The Library of Technology, Volume 291). Verlag Moderne Industrie, 2006, ISBN 3-937-88955-8. DIN 2304-1 Adhesive Technology - Quality Requirements for Adhesive Processes. Part 1: Process Chain.
Pressure sensitive adhesives are viscoelastic polymers with their rheology tuned to the desired bonding and de-bonding characteristics needed. [5] Typical materials used to make the adhesive include: acrylate polymer, [6] rubber, either natural rubber or synthetic thermoplastic elastomer; silicone rubber; and others
For bonding, the amount of thermal energy required is higher due to the need to first flow the adhesive and allow the two sides to come together into electrical contact, and then to cure the adhesive and create a lasting reliable bond. The temperatures, times, and pressure required for these processes can vary as shown in the following table.
Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE) .
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