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  2. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    The amount of time solder paste can stay on a stencil without affecting its printing properties. The paste manufacturer provides this value. Tack Tack is the property of a solder paste to hold a component after the component had been placed by the placement machine. Hence, tack life is the critical property of solder pastes.

  3. Reflow soldering - Wikipedia

    en.wikipedia.org/wiki/Reflow_soldering

    Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent ...

  4. Thermal profiling - Wikipedia

    en.wikipedia.org/wiki/Thermal_profiling

    In soldering, a thermal profile is a complex set of time-temperature values for a variety of process dimensions such as slope, soak, TAL, and peak. [8] Solder paste contains a mix of metal, flux, and solvents that aid in the phase change of the paste from semi-solid, to liquid to vapor; and the metal from solid to liquid.

  5. Copper tubing - Wikipedia

    en.wikipedia.org/wiki/Copper_tubing

    Solder fittings are smooth and easily slip onto the end of a tubing section. The joint is then heated using a torch, and the solder is melted into the connection. When the solder cools, it forms a very strong bond that can last for decades. Solder-connected rigid copper is the most popular choice for water supply lines in modern buildings.

  6. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Soldering copper pipes using a propane torch and a lead-free solder. Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties.

  7. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder.It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [1] as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. [2]

  8. Thermal paste - Wikipedia

    en.wikipedia.org/wiki/Thermal_paste

    Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.

  9. Dilution refrigerator - Wikipedia

    en.wikipedia.org/wiki/Dilution_refrigerator

    One design incorporates an inner vacuum can, which is used to initially precool the machine from room temperature down to the base temperature of the pulse tube cooler (using heat-exchange gas). However, every time the refrigerator is cooled down, a vacuum seal that holds at cryogenic temperatures needs to be made, and low temperature vacuum ...

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