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  2. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Cd70, thermal-free solder. Produces low thermal EMF joints in copper, does not form parasitic thermocouples. Used in low-temperature physics. [2] Sn 40 Pb 42 Cd 18: 145: Cd, Pb: Low melting temperature allows repairing pewter and zinc objects, including die-cast toys. Sn 50 Pb 32 Cd 18: 145 [16] Cd, Pb: Cd18: Cd 82.5 Zn 17.5: 265 [27] Cd: Yes

  3. Solder - Wikipedia

    en.wikipedia.org/wiki/Solder

    Most lead-free replacements for conventional 60/40 and 63/37 Sn-Pb solder have melting points from 50 to 200 °C higher, [17] though there are also solders with much lower melting points. Lead-free solder typically requires around 2% flux by mass for adequate wetting ability. [18] When lead-free solder is used in wave soldering, a slightly ...

  4. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method. The melting point of SAC alloys is 217–220 °C, or about 34 °C higher than the melting point of the eutectic tin-lead (63/37) alloy.

  5. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Lead free soldering requires higher soldering temperatures than lead/tin soldering. Sn Pb 63/37 eutectic solder melts at 183 °C. SAC lead-free solder melts at 217–220 °C. Nevertheless, many new technical challenges have arisen with this endeavor.

  6. Eutectic system - Wikipedia

    en.wikipedia.org/wiki/Eutectic_system

    Eutectic alloys for soldering, both traditional alloys composed of lead (Pb) and tin (Sn), sometimes with additional silver (Ag) or gold (Au) — especially Sn 63 Pb 37 and Sn 62 Pb 36 Ag 2 alloy formula for electronics - and newer lead-free soldering alloys, in particular ones composed of tin, silver, and copper (Cu) such as Sn 96.5 Ag 3.5.

  7. List of brazing alloys - Wikipedia

    en.wikipedia.org/wiki/List_of_brazing_alloys

    650/720 [37] 660/720 [38] – BAg-34, AMS 4761, Braze 380, Silvaloy A38T, Silver Braze 38. Free-flowing, for ferrous alloys, nickel, copper and their alloys, and combinations. Tin content improves wetting of tungsten carbide, stainless steel, and other difficult metals. Absence of lead and cadmium allows use of long heating cycles.

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  9. RoHS - Wikipedia

    en.wikipedia.org/wiki/RoHS

    The more common lead-free solder systems have a higher melting point, e.g. a 30 °C typical difference for tin-silver-copper alloys, but wave soldering temperatures are approximately the same at ~255 °C; [47] however at this temperature most typical lead-free solders have longer wetting times than eutectic Pb/Sn 37:63 solder. [49]