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  2. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Cd70, thermal-free solder. Produces low thermal EMF joints in copper, does not form parasitic thermocouples. Used in low-temperature physics. [2] Sn 40 Pb 42 Cd 18: 145: Cd, Pb: Low melting temperature allows repairing pewter and zinc objects, including die-cast toys. Sn 50 Pb 32 Cd 18: 145 [16] Cd, Pb: Cd18: Cd 82.5 Zn 17.5: 265 [27] Cd: Yes

  3. Solder - Wikipedia

    en.wikipedia.org/wiki/Solder

    Most lead-free replacements for conventional 60/40 and 63/37 Sn-Pb solder have melting points from 50 to 200 °C higher, [17] though there are also solders with much lower melting points. Lead-free solder typically requires around 2% flux by mass for adequate wetting ability. [18] When lead-free solder is used in wave soldering, a slightly ...

  4. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method. The melting point of SAC alloys is 217–220 °C, or about 34 °C higher than the melting point of the eutectic tin-lead (63/37) alloy.

  5. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Lead free soldering requires higher soldering temperatures than lead/tin soldering. Sn Pb 63/37 eutectic solder melts at 183 °C. SAC lead-free solder melts at 217–220 °C. Nevertheless, many new technical challenges have arisen with this endeavor.

  6. Eutectic system - Wikipedia

    en.wikipedia.org/wiki/Eutectic_system

    Eutectic alloys for soldering, both traditional alloys composed of lead (Pb) and tin (Sn), sometimes with additional silver (Ag) or gold (Au) — especially Sn 63 Pb 37 and Sn 62 Pb 36 Ag 2 alloy formula for electronics - and newer lead-free soldering alloys, in particular ones composed of tin, silver, and copper (Cu) such as Sn 96.5 Ag 3.5.

  7. Homologous temperature - Wikipedia

    en.wikipedia.org/wiki/Homologous_temperature

    Additionally, for a given fixed homologous temperature, two materials with different melting points would have similar diffusion-dependent deformation behaviour. For example, solder (T mp = 456 K) at 115 °C would have comparable mechanical properties to copper (T mp = 1358 K) at 881 °C, because they would both be at 0.85T mp despite being at ...

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  9. List of copper alloys - Wikipedia

    en.wikipedia.org/wiki/List_of_copper_alloys

    63 76 8 155 Good for cold-working; radiators, hardware, electrical, drawn cartridge cases. Phosphor bronze (ASTM B103, B139, B159) Cu 89.75, Sn 10.0, P 0.25 Spring temper — 122 4 241 High fatigue-strength and spring qualities Yellow or High brass (ASTM B36, B134, B135) Cu 65.0, Zn 35.0 Annealed 18 48 60 55 Good corrosion resistance Cold-drawn 55