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Pioneering theoretical analysis of spin coating was undertaken by Emslie et al., [3] and has been extended by many subsequent authors (including Wilson et al., [4] who studied the rate of spreading in spin coating; and Danglad-Flores et al., [5] who found a universal description to predict the deposited film thickness). Spin coating is widely ...
Layer-by-layer (LbL) deposition is a thin film fabrication technique. The films are formed by depositing alternating layers of complementary materials with wash steps in between. This can be accomplished by using various techniques such as immersion, spin, spray, electromagnetism, or fluidics. [1]
Thin-film printing technology is being used to apply solid-state lithium polymers to a variety of substrates to create unique batteries for specialized applications. Thin-film batteries can be deposited directly onto chips or chip packages in any shape or size. Flexible batteries can be made by printing onto plastic, thin metal foil, or paper.
There are four basic parameters that are involved in spin coating: solution viscosity, solid content (density), angular speed, and spin time. [13] A range of thicknesses can be achieved by spin coating. Most commonly the thicknesses range from 1-200 μm. The main properties that affect the thickness of the film are viscosity and spin speed.
The precursor sol can be either deposited on a substrate to form a film (e.g., by dip-coating or spin coating), cast into a suitable container with the desired shape (e.g., to obtain monolithic ceramics, glasses, fibers, membranes, aerogels), or used to synthesize powders (e.g., microspheres, nanospheres). [1]
A simple cross-section schematic of the slot-die coating process. Slot-die coating is a coating technique for the application of solution, slurry, hot-melt, or extruded thin films onto typically flat substrates such as glass, metal, paper, fabric, plastic, or metal foils.
Spin methods involve depositing materials onto a spinning substrate. This method is generally used for flat substrates due to inherent limitations of spin coaters. This method can be applied to polymers and colloids. Compared to immersive LbL methods, spin coating offers rapid assembly and improved film organization.
Thick-film technology is used to produce electronic devices/modules such as surface mount devices modules, hybrid integrated circuits, heating elements, integrated passive devices and sensors. The main manufacturing technique is screen printing ( stenciling ), which in addition to use in manufacturing electronic devices can also be used for ...
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