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Plastic leaded chip carrier (PLCC): square, J-lead, pin spacing 1.27 mm. Quad flat package (QFP): various sizes, with pins on all four sides. Low-profile quad flat-package (LQFP): 1.4 mm high, varying sized and pins on all four sides. Plastic quad flat-pack (PQFP), a square with pins on all four sides, 44 or more pins.
Chips or crisps are often served with dipping sauces; together they are referred to as chips and dip. Chips used include potato chips, tortilla chips, corn chips, bean chips, vegetable chips, pita chips, [1] plantain chips [2] and others. Crackers are also sometimes used, [3] as are crudités, which are whole or sliced raw vegetables.
The SN7400N chip contains four two-input NAND gates. The SN prefix indicates it was manufactured by Texas Instruments [1] The N suffix is a vendor-specific code indicating plastic DIP packaging. The second line of numbers (7645) is a date code; this chip was manufactured in the 45th week of 1976. [2]
Beer Queso. Costco offers several different dip options for no-fuss party appetizers. Beer queso can go well with tortilla chips, but not with much else.
dill pickle chips. Potato chips and sliced veggies, for serving. Directions. Combine the sour cream, cream cheese, pickle juice, and fresh dill in the bowl of a food processor and pulse until ...
Eight-contact DIP switch with 0.3" wide 16-pin (DIP16N) footprint. In microelectronics, a dual in-line package (DIP or DIL) [1] is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket.
A chip (American English and Australian English) or crisp (British English and Irish English) is a snack food in the form of a crisp, flat or slightly bowl shaped, bite-sized unit. Some chips can be made into dishes and served as an appetizer, side, hors d'oeuvre, etc. Some types of chip are often served in the combination plate, chips and dip.
Dual in-line (DIP) integrated circuit metal lead frame tape with contacts. Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the ...
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