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The "feedstock" (coating precursor) is heated by electrical (plasma or arc) or chemical means (combustion flame). Thermal spraying can provide thick coatings (approx. thickness range is 20 microns to several mm, depending on the process and feedstock), over a large area at high deposition rate as compared to other coating processes such as ...
Sputter deposition: a glow plasma discharge (usually localized around the "target" by a magnet) bombards the material sputtering some away as a vapor for subsequent deposition. Pulsed electron deposition: a highly energetic pulsed electron beam ablates material from the target generating a plasma stream under nonequilibrium conditions.
Solution precursor plasma spray (SPPS) is a thermal spray process where a feedstock solution is heated and then deposited onto a substrate. Basic properties of the process are fundamentally similar to other plasma spraying processes. However, instead of injecting a powder into the plasma plume, a liquid precursor is used.
Plasma transferred wire arc (PTWA) thermal spraying is a thermal spraying process that deposits a coating on the internal surface of a cylindrical surface, or external surface of any geometry. It is predominantly known for its use in coating the cylinder bores of an internal combustion engine , enabling the construction of aluminium engine ...
Plasma electrolytic oxide coatings are generally recognized for high hardness, wear resistance, and corrosion resistance. However, the coating properties are highly dependent on the substrate used, as well as on the composition of the electrolyte and the electrical regime used (see 'Equipment used' section, above).
Sputter-coated ant specimen (Aulacopone relicta) for SEM examination. Sputter coating in scanning electron microscopy is a sputter deposition process [clarification needed] to cover a specimen with a thin layer of conducting material, typically a metal, such as a gold/palladium (Au/Pd) alloy. A conductive coating is needed to prevent charging ...
Plasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases.
Plasma cleaning is the removal of impurities and contaminants from surfaces through the use of an energetic plasma or dielectric barrier discharge (DBD) plasma created from gaseous species. Gases such as argon and oxygen , as well as mixtures such as air and hydrogen/nitrogen are used.
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