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A heat sink is not a device with the "magical ability to absorb heat like a sponge and send it off to a parallel universe". [2] Natural convection requires free flow of air over the heat sink. If fins are not aligned vertically, or if fins are too close together to allow sufficient air flow between them, the efficiency of the heat sink will ...
The most common design of a heat sink is a metal device with many fins. The high thermal conductivity of the metal combined with its large surface area result in the rapid transfer of thermal energy to the surrounding, cooler, air. This cools the heat sink and whatever it is in direct thermal contact with.
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan. Vertical aluminium ...
A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. There are two thermodynamic types, passive and active. The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond. An active heat spreader speeds up heat ...
A multi-surface cooler is a sub-type of passive cooler. It allows airflow both between the laptop base and cooler, and between the base of the cooler and the user's lap. These laptop coolers are suitable for laptops that have vents on the underside. The multi-surface cooling design typically works on any surface without blocking any vents.
Jennifer and Brandon Sheffield were found dead by gunshot wounds in an apparent murder-suicide by police in Mississippi on Dec. 28, according to reports
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually not electrically conductive) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high ...
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