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AC: across corners: Commonly used when measuring the corners of a hex drive, such as a hex nut. AF: across flats: Commonly used when measuring the flat surfaces of a hex drive, such as a hex nut. AFF above finished floor A dimension that establishes a distance away from the finished floor.
Packaged terminal air conditioner installed in a residential apartment. A packaged terminal air conditioner (PTAC) is a type of self-contained heating and air conditioning system intended to be mounted through a wall. [1] The first practical semi-portable air conditioning unit invented by engineers at Chrysler Motors. It entered the market in ...
A split-phase or single-phase three-wire system is a type of single-phase electric power distribution. It is the alternating current (AC) equivalent of the original Edison Machine Works three-wire direct-current system. Its primary advantage is that, for a given capacity of a distribution system, it saves conductor material over a single-ended ...
The output of the infrared LED (like that of any infrared remote) is invisible to the human eye because its wavelength is beyond the range of visible light (940 nm). This system is commonly used on mini-split air conditioners because it is simple and portable. Some window and ducted central air conditioners uses it as well.
An air conditioning system, or a standalone air conditioner, provides cooling and/or humidity control for all or part of a building. Air conditioned buildings often have sealed windows, because open windows would work against the system intended to maintain constant indoor air conditions.
Schematic of split-pi converter topology. In electronics, a split-pi topology is a pattern of component interconnections used in a kind of power converter that can theoretically produce an arbitrary output voltage, either higher or lower than the input voltage. In practice the upper voltage output is limited to the voltage rating of components ...
These two junctions split power equally, but because of the different field configurations at the junction, the electric fields at the output arms are in phase for the H-plane tee and are 180° out of phase for the E-plane tee. The combination of these two tees to form a hybrid tee is known as the magic tee. The magic tee is a four-port ...
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits.