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  2. Meteor Lake - Wikipedia

    en.wikipedia.org/wiki/Meteor_Lake

    Meteor Lake is the codename for Core Ultra Series 1 mobile processors, designed by Intel [3] and officially released on December 14, 2023. [4] It is the first generation of Intel mobile processors to use a chiplet architecture which means that the processor is a multi-chip module. [3]

  3. List of Intel Core processors - Wikipedia

    en.wikipedia.org/wiki/List_of_Intel_Core_processors

    The latest badge promoting the Intel Core branding. The following is a list of Intel Core processors.This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.

  4. Arrow Lake (microprocessor) - Wikipedia

    en.wikipedia.org/wiki/Arrow_Lake_(microprocessor)

    Arrow Lake is the codename for Core Ultra Series 2 processors designed by Intel, released on October 24, 2024.It follows on from Meteor Lake which saw Intel move from monolithic silicon to a disaggregated MCM design.

  5. MSI Claw A1M - Wikipedia

    en.wikipedia.org/wiki/MSI_Claw_A1M

    It has a 7-inch 120HZ LCD IPS display, and is powered by a Meteor Lake-based Intel Core Ultra 5 135H or Ultra 7 155H, with 8 Xe GPU cores and 12 CPU cores (4 performance + 8 efficiency, 135H) or 14 CPU cores (6 performance + 8 efficiency, 155H).

  6. Intel Core - Wikipedia

    en.wikipedia.org/wiki/Intel_Core

    Intel Core Ultra sub-brand logos, from 2023 to present ... 0.7 GHz 48 Core i3 1000NG4: 2 (4) 1.1 GHz 3.2 Iris Plus 48 0.9 GHz 4 MiB 9 W 1000G4. 12 W 1000G1:

  7. Lunar Lake - Wikipedia

    en.wikipedia.org/wiki/Lunar_Lake

    An analysis by Goldman Sachs indicated that Intel would be spending $5.6 billion in 2024 and $9.7 billion in 2025 outsourcing to TSMC. [5] In March 2024, Intel's chief financial officer admitted during an investment call that the company was "a little bit heavier than we want to be in terms of external wafer manufacturing versus internal". [ 6 ]

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