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2. Potting (electronics) - Wikipedia

   en.wikipedia.org/wiki/Potting_(electronics)

   [4] As an alternative, many circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting. [5] Conformal coating gives most of the benefits of potting, and is lighter and easier to inspect, test, and repair. Conformal coatings can be applied as liquid or condensed from a vapor phase.

3. Footprint (electronics) - Wikipedia

   en.wikipedia.org/wiki/Footprint_(electronics)

   Populated (rear) and unpopulated (front) TSOP land patterns on a printed circuit board. A row of through-holes acting as the footprint for a pin header.. A footprint or land pattern is the arrangement of pads (in surface-mount technology) [1] or through-holes (in through-hole technology) used to physically attach and electrically connect a component to a printed circuit board.

4. Chip on board - Wikipedia

   en.wikipedia.org/wiki/Chip_on_board

   In "wire bonding", the chip is attached to the board with an adhesive. Each pad on the device is connected with a fine wire lead that is welded to the pad and to the circuit board. This is similar to the way that an integrated circuit is connected to its lead frame, but instead the chip is wire-bonded directly to the circuit board. [3]

5. 1-Wire - Wikipedia

   en.wikipedia.org/wiki/1-Wire

   1-Wire is a wired half-duplex serial bus designed by Dallas Semiconductor that provides low-speed (16.3 kbit/s [1]) data communication and supply voltage over a single conductor. [ 2 ] 1-Wire is similar in concept to I 2 C , but with lower data rates and longer range.

6. Flat no-leads package - Wikipedia

   en.wikipedia.org/wiki/Flat_no-leads_package

   Different manufacturers use different names for this package: ML (micro-leadframe) versus FN (flat no-lead), in addition there are versions with pads on all four sides (quad) and pads on just two sides (dual), thickness varying between 0.9–1.0 mm for normal packages and 0.4 mm for extremely thin. Abbreviations include:

7. Via (electronics) - Wikipedia

   en.wikipedia.org/wiki/Via_(electronics)

   (1) Through hole. (2) Blind via. (3) Buried via. The gray and green layers are nonconducting, while the thin orange layers and red vias are conductive. A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole ...